Day to Day:

• Collect, prepare, image, and document the structure and/or composition of nanostructures related to semiconductor devices.
• Manage the queue of samples and cleaving/analysis instructions from the Process Engineering staff
• Lamella preparation using Focused Ion Beam (FIB) tools
• Sample preparation for FIB stub by hand cleave and tweezers
• Transfer Grids to sample holders using tweezers
• Imaging sample features utilizing Scanning Electron Microscopy (SEM], Transmission Electron Microscopy (TEM), Scanning Transmission Electron Microscopy (STEM)
• Collecting compositional feature data utilizing Energy-dispersive X-ray spectroscopy (EDX) and Electron Energy Loss Spectroscopy (EELS)
• Communicating image and compositional results to the Engineering staff
• Development and optimization of sample preparation and analysis techniques
• Train new users on sample Preparation and Analysis Equipment
• Update and maintain Training and certification documents for sample Preparation and Analysis Equipment
• Actively participate and contribute to continuous FIB Operations efficiency improvement
• Possible responsibilities could include in FAB operations

Must Haves:

• 1 year of experience as a Process Technician performing sample analysis
• Hands-on experience leveraging FIB, STEM, or TEM equipment
• Ability to work with hand tools under a microscope (tweezers, screwdriver, scribe, ect.)
• Bachelors degree in Physical Science or 4 years of experience

Pluses:

 Experience working within a fab environment leveraging the following tools:

• Hitachi/ThermoFisher non-automated FIB
• ThermoFisher TEM
• Hitachi SEM